AI-Powered Precision Redefining Packing Operations

Manual packing is slow, error-prone, and expensive, leading to losses across industries like food production, electronics, medical biotech, and automotive due to mislabeling, workflow bottlenecks, and labor-intensive packing processes. Companies that fail to adapt to smarter, AI-driven automation are at risk of falling behind. In response, ASRock Industrial and Solomon joined forces to introduce the AI Packing Solution – a next-generation smart packaging system that integrates ASRock Industrial’s iEP-6010E Series with NVIDIA Jetson Orin NX SOM and Solomon’s META-aivi AR + AI vision system. This collaboration doesn’t just improve packing workflows, it redefines them with precision, intelligence and automation.

Challenges

Across Industries – from food production, medical biotech, automotive, electronics, logistic to manufacturing and more face increasing pressure to enhance operational efficiency, maintain quality control, and reduce human errors in standard operating procedures (SOPs). Manual processes, especially in packing, inspection, and assembly, often lead to inconsistencies, inefficiencies, and costly rework. Labor shortage further compound these challenges, making it difficult to scale operations while maintaining precision, safety, and compliance. Many industries struggle with training new workers on complex tasks, resulting in delayed production, inconsistent quality, and regulatory risks. 

Additionally, real-time tracking and data-driven optimization remain key concerns. Traditional SOP execution relies heavily on manual verification, increasing the risk of mislabeling, incorrect packing configurations, and non-compliance with industry standards. Businesses need AI-powered, adaptive solutions that seamlessly integrate into existing workflows, enabling real-time guidance, automated verification, and optimized efficiency.  
 

Solutions

To transform manual packing SOPs into an intelligent and automated process, ASRock Industrial and Solomon developed the AI Packing Solution, an advanced AI-guided packing system designed to optimize SOP execution and enhance workflow precision across multiple industries. By integrating ASRock Industrial’s iEP-6010E Series powered by NVIDIA Jetson Orin NX SOM with Solomon’s META-aivi AR + AI vision system, the AI Packing Solution brings real-time AI vision processing and automated verification to packing operations, ensuring accuracy, reducing errors, and boosting productivity. 

The AI Packing Solution enables fast AI model training with 90% fewer samples needed, offering real-time image recognition and inference to guide workers through the correct packing steps, eliminating mislabeling, sorting mistakes, and incorrect item placement. By providing instant feedback and validation, it significantly reduces rework costs and defective shipments. With its high-speed AI processing capabilities, the AI Packing Solution can handle complex datasets, rapidly analyze product variations, and automate SOP execution without requiring extensive human intervention. The system is designed to be user-friendly and adaptable, allowing businesses to integrate AI-driven automation into their workflows seamlessly. 

Furthermore, the AI Packing Solution is scalable across industries, making it an ideal solution for businesses in automotive, electronics, petrochemicals, and food production, where precise packing and labeling are essential for compliance, safety, and operational efficiency.  
 

Benefits

The Implementation of ASRock Industrial’s iEP-6010E and Solomon’s META-aivi AR + AI vision system in the AI Packing Solution has delivered significant improvements in accuracy, efficiency, and operational intelligence across industries

 

Enhanced packing accuracy and quality control

By leveraging AI-driven vision and real-time validation, the AI Packing Solution has eliminated human errors in sorting, labeling, and packing. The system ensures that each item is packed correctly and verified instantly, preventing mislabeling, missing components, and defective shipments. This has resulted in a measurable reduction in packing errors, product recalls, and rework costs. 

Optimized efficiency and workflow productivity

The AI Packing Solution accelerates SOP execution by automating key packing processes and minimizing manual intervention. The system’s AI-guided workflows improve packing speed by up to 30%, allowing businesses to handle higher volumes with greater precision and reduces processing time. This optimization significantly enhances throughput and overall production capacity. 

Reduced labor costs and resource utilization

Traditional packing operations are highly dependent on manual labor, leading to increased staffing costs, skill shortages, and training inefficiencies. With AI automation, the AI Packing Solution reduces reliance on manual labor while maintaining high accuracy and efficiency. This translates into lower operational costs, improved labor allocation, and reduced downtime. 

相關產品

iEP-6010E Series

  • NVIDIA Jetson Orin NX 16GB SOM Super Mode support, up to 157 SPARSE (78 DENSE) INT8 TOPS
  • POE SKU integrates 2x POE ports. Each port supports IEEE 802.3AF
  • Anti Shock and Vibration
  • Wide Range Operating Temperature
  • 12-36V Phoenix type DC IN support
  • 2nd DC IN Interface (PD3.0 20V USB Type-C with Locking feature) for Mobile device application or Redundant power source
  • Wall Mount or DIN-Rail for Vertical IPC Installation (All SKU). Wall Mount or VESA Mount for Horizontal IPC Installation (BASIC SKU only)
  • Carrier board reserved 2pcs Four Lane MIPI-CSI2 connectors (Option for DSC-NV002-WT R1.02)**
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NVIDIA Jetson Orin NX/Nano Developer Kit

  • NVIDIA Jetson Orin NX SOM 16GB/8GB Super Mode support, up to 157 SPARSE (78 DENSE) INT8 TOPS
  • NVIDIA Jetson Orin Nano 8GB/4GB SOM support, up to 67 SPARSE (33 DENSE) INT8 TOPS
  • POE SKU integrates 2x POE ports. Each port supports IEEE 802.3AF
  • Wide Range Operating Temperature
  • 12-36V Phoenix type DC IN support
  • Carrier board reserved 2pcs Four Lane MIPI-CSI2 connectors (Option for DSC-NV002-WT R1.02)**
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iEP-6011E Series

  • NVIDIA Jetson Orin NX 8GB SOM Super Mode support, up to 117 SPARSE (58 DENSE) INT8 TOPS
  • POE SKU integrates 2x POE ports. Each port supports IEEE 802.3AF
  • Anti Shock and Vibration
  • Wide Range Operating Temperature
  • 12-36V Phoenix type DC IN support
  • 2nd DC IN Interface (PD3.0 20V USB Type-C with Locking feature) for Mobile device application or Redundant power source
  • Wall Mount or DIN-Rail for Vertical IPC Installation (All SKU). Wall Mount or VESA Mount for Horizontal IPC Installation (BASIC SKU only)
  • Carrier board reserved 2pcs Four Lane MIPI-CSI2 connectors (Option for DSC-NV002-WT R1.02)**
了解更多