2025-06-27 半導體IC載板檢測再進化 和碩攜東擎科技強化智慧檢測效能
一家知名半導體封裝廠於其IC載板製程中，導入先進自動光學檢測（AI AOI）系統，應用於二階段檢測，以優化自動視覺檢測（AVI）後的瑕疵篩選作業。這套AI AOI解決方案結合由和碩開發的全流程AI平台PEGAAi，以及東擎科技（ASRock Industrial）工業級強固邊緣AIoT系統平台iEPF‑9030S，並運用邊緣AI進行異常判斷，大幅減少人工複檢的負擔，提升檢測效率並穩定製程良率。此系統展現AI軟體與高性能硬體的強大協同效益，加速半導體智慧製造發展進程。目前全球逾13座和碩廠區已部署PEGAAi平台，累計應用規模達400至500個生產站點，充分展現擴充彈性與實際應用價值。
Challenges
IC substrate manufacturing is a critical and technically demanding process within semiconductor packaging. As demand for high-performance, compact, and energy-efficient devices grows, the manufacturing needs to meet miniaturization and high-density design, stringent yield and quality control, and managing complex materials and processes. Overcoming these is crucial to ensure reliability and performance of devices across applications from consumer electronics to automotive and high-performance computing.
In quality control process, traditional Auto Vision Inspection (AVI) systems often generate excessive false positives commonly referred to as “overkill”, where non-defective units are misclassified, as defective. This results in an unnecessary increase in Vision Repair System (VRS) human re-inspection workload, requiring many human operators to manually review large volumes of samples that ultimately do not contain defects. The repetitive nature of human re-inspection process not only consumes substantial labor resources but also reduces inspection throughput and contributes to operator fatigue. Compounding this issue is the absence of a real-time AI integration framework capable of pre-filtering these false positives at the edge, preventing the intelligent allocation of inspection resources and limiting opportunities for process automation and continuous improvement.
Solution
To address these challenges, the leading global semiconductor packaging provider implemented a comprehensive AI-driven inspection solution that integrates PEGATRON’s PEGAAi platform with ASRock Industrial’s iEPF-9030S Robust Edge AIoT Platform to enhance IC substrate quality control. The AI station, powered by PEGAAi platform and iEPF-9030S, performs second-stage screening between the Auto Vision Inspection (AVI) and Vision Repair System (VRS) stages, automatically classifying and filtering out false positives to minimize unnecessary human intervention.
ASRock Industrial’s iEPF-9030S, equipped with Intel® 14th Gen Core™ processors and NVIDIA RTX 5000 ADA GPUs, provides the high computing power required to execute AI model training on-site and perform real-time AI inference of defects inspection. The solution further incorporates Auto MLOps workflows for model optimization and AI performance dashboards, enabling continuous feedback from operator re-inspection to refine the AI model. This end-to-end integration not only streamlines the inspection process but also ensures adaptability, scalability, and sustained accuracy in demanding semiconductor production environments.
Benefits
The implementation of PEGATRON’s PEGAAi platform in combination with ASRock Industrial’s iEPF-9030S Robust Edge AIoT Platform for IC substrate inspection has delivered measurable improvements in inspection accuracy, labor efficiency, and system scalability within high-volume semiconductor manufacturing environments.
• Significant Reduction in Manual Workload
By introducing AI-powered second screening before operator involvement, the system reduced excessive false positives generated by AVI machines. This directly lowered the need for labor-intensive visual re-inspection, cutting manual workload by 50-70% and improving workforce allocation.
• Enhanced Inspection Accuracy and Production Quality
Through accurate anomaly classification and continuous AI model refinement, the solution minimized overkill incidents and false defect identifications. This led to improved defect detection precision, enhanced yield stability, and more consistent product quality.
• Streamlined Operational Efficiency with Real-Time AI
The integration of high-performance edge computing enabled real-time inference and on-site retraining, solving delays caused by disconnected or centralized inspection systems. This improved responsiveness and supported faster, more intelligent decision-making on the production line.
• Improved System Scalability and Factory-Wide Consistency
The modular architecture allowed the solution to be scaled and deployed across over 13 PEGATRON factories globally, with a total of 400-500 sites. This eliminated the scalability barriers of traditional inspection systems, enabling consistent quality control across multi-site operations.
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