Transforming Semiconductor IC Substrate Inspection with AI, Powered by PEGATRON and ASRock Industrial

A global leader in semiconductor packaging, specializing in IC substrate manufacturing, deployed an advanced AI AOI system for second-stage inspection to streamline its post-AVI (Automated Visual Inspection) process. The solution integrates PEGATRON’s PEGAAi, an end-to-end AI platform, with ASRock Industrial’s iEPF-9030S Robust Edge AIoT Platform. By leveraging edge AI capabilities, the solution performs automatic anomaly detection, significantly reducing manual re-inspection workload, improving inspection efficiency, and enhancing yield stability. The deployment highlights the powerful synergy of smart AI software and rugged, high-performance hardware, accelerating smart manufacturing in the semiconductor industry.

Challenges

IC substrate manufacturing is a critical and technically demanding process within semiconductor packaging. As demand for high-performance, compact, and energy-efficient devices grows, the manufacturing needs to meet miniaturization and high-density design, stringent yield and quality control, and managing complex materials and processes. Overcoming these is crucial to ensure reliability and performance of devices across applications from consumer electronics to automotive and high-performance computing.

In quality control process, traditional Auto Vision Inspection (AVI) systems often generate excessive false positives commonly referred to as “overkill”, where non-defective units are misclassified, as defective. This results in an unnecessary increase in Vision Repair System (VRS) human re-inspection workload, requiring many human operators to manually review large volumes of samples that ultimately do not contain defects. The repetitive nature of human re-inspection process not only consumes substantial labor resources but also reduces inspection throughput and contributes to operator fatigue. Compounding this issue is the absence of a real-time AI integration framework capable of pre-filtering these false positives at the edge, preventing the intelligent allocation of inspection resources and limiting opportunities for process automation and continuous improvement.

Solutions

To address these challenges, the leading global semiconductor packaging provider implemented a comprehensive AI-driven inspection solution that integrates PEGATRON’s PEGAAi platform with ASRock Industrial’s iEPF-9030S Robust Edge AIoT Platform to enhance IC substrate quality control. The AI station, powered by PEGAAi platform and iEPF-9030S, performs second-stage screening between the Auto Vision Inspection (AVI) and Vision Repair System (VRS) stages, automatically classifying and filtering out false positives to minimize unnecessary human intervention.

ASRock Industrial’s iEPF-9030S, equipped with Intel® 14th Gen Core™ processors and NVIDIA RTX 5000 ADA GPUs, provides the high computing power required to execute AI model training on-site and perform real-time AI inference of defects inspection. The solution further incorporates Auto MLOps workflows for model optimization and AI performance dashboards, enabling continuous feedback from operator re-inspection to refine the AI model. This end-to-end integration not only streamlines the inspection process but also ensures adaptability, scalability, and sustained accuracy in demanding semiconductor production environments.

Benefit

The implementation of PEGATRON’s PEGAAi platform in combination with ASRock Industrial’s iEPF-9030S Robust Edge AIoT Platform for IC substrate inspection has delivered measurable improvements in inspection accuracy, labor efficiency, and system scalability within high-volume semiconductor manufacturing environments.

Significant Reduction in Manual Workload

By introducing AI-powered second screening before operator involvement, the system reduced excessive false positives generated by AVI machines. This directly lowered the need for labor-intensive visual re-inspection, cutting manual workload by 50-70% and improving workforce allocation.

Enhanced Inspection Accuracy and Production Quality

Through accurate anomaly classification and continuous AI model refinement, the solution minimized overkill incidents and false defect identifications. This led to improved defect detection precision, enhanced yield stability, and more consistent product quality.

Streamlined Operational Efficiency with Real-Time AI

The integration of high-performance edge computing enabled real-time inference and on-site retraining, solving delays caused by disconnected or centralized inspection systems. This improved responsiveness and supported faster, more intelligent decision-making on the production line.

Improved Decision-Making On the Line

This improved responsiveness and supported faster, more intelligent decision-making on the production line, leading to reduced production delays and optimized process control.

相关产品

iEPF-9020S-EY4

  • Intel® 13th Gen Core™ Processors with R680E Chipset
  • 4 x 260-pin DDR4 SO-DIMM up to 128GB (32GB per DIMM)
  • 1 x PCIe x16 (PCIe Gen4) or 2 x PCIe x8 (PCIe Gen4), 2 x PCIe x 4 (PCIe Gen4)
  • 1 x M.2 Key M, 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
  • 6 x USB 3.2 Gen2x1, 6 x COM, Up to 4 x SATA3 (Default 1 piece), 8 x DI, 8 x DO
  • 5 x Intel 2.5G LAN (2 support PoE, LAN 1 supports vPro)
  • 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
  • Support Wireless Time-Sensitive Networking (WTSN)
  • Powerful Edge AI acceleration enabled by the most flexible mechanical, thermal, and power design, with support for 275 mm x 138 mm x 60mm (D x H x W) max. and up to 300W graphic card
  • Supported NVIDIA GPU: RTX 4000 Ada, RTX 2000 Ada, RTX A2000, A2
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iEPF-9030S-EW4

  • Intel® 14th Gen Core™ Processors with R680E Chipset
  • 2 x 262-pin DDR5 SO-DIMM up to 96GB (48GB per DIMM)
  • 1 x PCIe x16 ( PCIe Gen5) or 2 x PCIe x8 ( PCIe Gen5),
  • 2 x PCIe x 4 (PCIe Gen4)
  • 2 x M.2 Key M, 2 x M.2 Key B, 1 x M.2 Key E
  • 6 x USB 3.2 Gen2x1, 6 x COM, Up to 4 x SATA3 (Default 1 piece), 8 x DI, 8 x DO
  • 5 x Intel 2.5G LAN (2 support PoE, LAN 1 supports vPro)
  • 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
  • Support Wireless Time-Sensitive Networking (WTSN)
  • Powerful Edge AI acceleration enabled by the most flexible mechanical, thermal, and power design, with support for 275 mm x 138 mm x 60 mm (D x H x W) max. and up to single 600W graphic card
  • Supported NVIDIA GPU: RTX 4000 Ada, RTX 2000 Ada, RTX A2000, A2
  • TAA Compliant
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iEPF-9040S-EW4

  • Intel® Core™ Processors (Series 2) with R680E Chipset
  • 2 x 262-pin DDR5 SO-DIMM up to 96GB (48GB per DIMM)
  • 1 x PCIe x16 ( PCIe Gen5) or 2 x PCIe x8 ( PCIe Gen5),
  • 2 x PCIe x 4 (PCIe Gen4)
  • 2 x M.2 Key M, 2 x M.2 Key B, 1 x M.2 Key E
  • 6 x USB 3.2 Gen2x1, 6 x COM, Up to 4 x SATA3 (Default 1 piece), 8 x DI, 8 x DO
  • 5 x Intel 2.5G LAN (2 support PoE, LAN 1 supports vPro)
  • 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
  • Support Wireless Time-Sensitive Networking (WTSN)
  • Powerful Edge AI acceleration enabled by the most flexible mechanical, thermal, and power design, with support for 275 mm x 138 mm x 60 mm (D x H x W) max. and up single to 600W graphic card and 245mm x 138 mm x 60 mm (D x H x W) max. with optional fan kit
  • Supported NVIDIA GPU: RTX 4000 Ada, RTX 2000 Ada, RTX A2000, A2
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