Open Process Automation (OPA) is revolutionizing industrial automation by offering unmatched flexibility, security, and efficiency while redefining industry standards. ASRock Industrial is spearheading this transformation, driving innovation with Distributed Control Nodes (DCNs) that eliminate vendor lock-in, enhance system interoperability, and ensure future-proof automation. By embracing an open, software-defined approach, ASRock Industrial’s DCNs has been integrated into the OPA system of a global leading energy company, setting new benchmarks in industrial automation, and enabling long-term scalability and operational efficiency.
了解更多Taipei, Taiwan (May 13th, 2025) – ASRock Industrial is set to make a powerful return to COMPUTEX Taipei, taking place from May 20th – May 23rd 2025 at the Nangang Exhibition Center, Booth L0818. This year, ASRock Industrial will showcase its latest breakthrough in Robust Edge AIoT Platform, Embedded Computer System, and Industrial motherboards. A major highlight includes live demonstrations of InduAgent AI-driven Industrial Agent, AI Pack Station, AI Robotic Orchestration, and SPE Control, the first x86 platform with single-pair Ethernet, providing a firsthand look at how AI is redefining smart factory automation and real-time industrial operations. The event is set to be a central hub for industry professionals and technology enthusiasts eager to explore the future of Edge AIoT computing, driven by ASRock Industrial’s newest innovations.
了解更多Taipei Taiwan (May 6th, 2025) The future of edge AI and industrial automation isn’t just about deploying more devices, it’s about deploying them faster, smarter and more securely at scale. ASRock Industrial introduces Ai FDO (ASRock Industrial FIDO Device Onboarding), a newly developed zero-touch, automated, and highly secure onboarding solution based on the FIDO Alliance industry standard. This innovative solution is designed to streamline device provisioning and onboarding for industrial AI, automation, and edge computing across diverse industries, including smart factories, industrial automation, smart cities, and retail. As industries move toward AI-driven manufacturing, predicative analytics, and large scale automation, companies require a faster, more secure, and scalable way to configure and deploy industrial devices. Ai FDO eliminates complexity, enabling secure, automated, and scalable device deployment from factory to field without human intervention. As part of ASRock Industrial’s commitment to Open Process Automation™ Forum (O-PAS™), Ai FDO is built to support vendor-neutral, software-defined industrial control systems, ensuring seamless integration across modern industrial infrastructures. More than just a device onboarding tool, Ai FDO is a transformative solution that accelerates industrial and edge AI adoption, strengthens cybersecurity, and ensures future-proof interoperability.
了解更多ASRock Industrial strengthens open and secure Edge AI computing with solutions certified for FIDO Device Onboard (FDO) and compliant with IEC 62443-4-1 and 4-2 standards for industrial cybersecurity.
了解更多(Taipei, April 16, 2025) — ASRock Industrial, with its leading industrial-grade cybersecurity capabilities, was invited to exhibit at CYBERSEC 2025 Taiwan. At the "Cyber Taiwan Pavilion" in the Cybersecurity for AI Applications Zone, ASRock Industrial showcased the Zero Trust-based Edge AI security solutions. President Lai Ching-te attended the opening ceremony and visited the booth, witnessing ASRock Industrial's latest innovations in secure edge AI applications. ASRock Industrial provides edge AI devices with comprehensive industrial cybersecurity protection and obtains both IEC 62443-4-1 and IEC 62443-4-2 international industrial security certifications. ASRock Industrial is also the first in Taiwan to be certified by the FIDO Alliance for FIDO Device Onboard (FDO). The showcased solution integrates FDO technology developed in collaboration with the Industrial Technology Research Institute (ITRI), enabling automated onboarding, authentication, and deployment of edge AI devices. This zero-touch process minimizes human error and significantly enhances cybersecurity across AI application scenarios.
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The manufacturing industry is evolving at an unprecedented pace, demanding real-time intelligence, predictive capabilities, and adaptive decision-making. ASRock Industrial and Aimirim have partnered to implement IEC 61499-powered smart and open process for a global tobacco company, incorporating AI agent solutions that offer real-time suggestions and troubleshooting. By combing ASRock Industrial’s iEP-6010E edge AI device with Aimirim’s Shaman, this solution brings real-time AI agent to factory operations such as quality control, production, and maintenance, empowering operators with instant, intelligent recommendations to resolve production inefficiencies.
Taipei, Taiwan (April 1, 2025) – ASRock Industrial is pleased to announce its participation in Automate 2025, taking place from May 12th – 15th, 2025 at Huntington Place in Detroit, Booth 4647. As a global leader in edge computing and Industrial motherboards solutions, ASRock Industrial will showcase its latest Robust Edge AIoT Platform, Industrial IoT Controller, Embedded Computer System, and Motherboard, demonstrating cutting-edge innovations in edge AI computing. Attendees will also have the opportunity to witness a live demonstration of the Flying Shear Solution, highlighting ASRock Industrial’s advanced real-time control and precision computing capabilities. Visit our booth to explore how our solutions are shaping the future of intelligent automation and industrial AI applications.
了解更多Taipei Taiwan (March 25, 2025) ASRock Industrial introduces the iEP(F)-9040 Series, a next-generation Robust Edge AIoT Platform designed to deliver high-performance edge AI computing, real-time industrial automation, and scalable expansion for smart manufacturing, intelligent vision systems, autonomous robotics, and edge AI applications. Powered by Intel® Core 200S Processors (Bartlett Lake-S), the iEP(F)-9040 Series enables seamless AI inferencing, high-speed data processing, and intelligent edge computing for industrial IoT and AIoT applications. With support for up to 24 cores and 32 threads with enhanced longevity, DDR5 5600MHz memory up to 96GB, PCIe Gen5 expansion, the Series is built to handle complex AI workloads. Designed to thrive in extreme industrial conditions, the series supports up to -40°C~75°C wide operating temperature range and 9V-36V DC power input with ignition control, ensuring reliable operation in mission-critical environments. The iEP(F)-9040 Series features rich industrial I/O, supports real-time TSN/TCC, and connectivity options like 5G/4G LTE, Wi-Fi 6E and BT 5.4 for high-speed, low-latency communication. The Series is ideal for various industrial applications such as smart factory, AI-based Inspection, robotics, surveillance, smart transportation, and more, providing a future-ready AIoT solution for next generation edge and industrial intelligence.
了解更多Taipei, Taiwan (March 18, 2025) – ASRock Industrial is pleased to announce its participation in Japan IT Week 2025, taking place from April 23rd – 25th, 2025, at Tokyo Big Sight, Booth 24-12. As a leading provider of industrial computing solutions, ASRock Industrial will present its latest Robust Edge AIoT Platform, Industrial IoT Controller, Mini PC, and Motherboard solutions, demonstrating cutting-edge advancements in edge AI computing. Attendees will also have the opportunity to experience a live demonstration of the Multilingual AI Service, an innovative AI-driven real-time translation solution designed to enhance global business communication. We would like to extend an invitation for you to visit our booth and look forward to your visit.
了解更多Manual packing is slow, error-prone, and expensive, leading to losses across industries like food production, electronics, medical biotech, and automotive due to mislabeling, workflow bottlenecks, and labor-intensive packing processes. Companies that fail to adapt to smarter, AI-driven automation are at risk of falling behind. In response, ASRock Industrial and Solomon joined forces to introduce the AI Packing Solution – a next-generation smart packaging system that integrates ASRock Industrial’s iEP-6010E Series with NVIDIA Jetson Orin NX SOM and Solomon’s META-aivi AR + AI vision system. This collaboration doesn’t just improve packing workflows, it redefines them with precision, intelligence and automation.
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