CPU | Intel® 15th Gen Core™ Processors |
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Chipset | Intel® H610 |
Socket | LGA 1700 |
Technology | Dual Channel DDR5 5600MHz |
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Capacity | 96 GB (48 GB per DIMM) |
Socket | 2 x 262-pin SO-DIMM |
Controller | Intel® UHD Graphics |
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DisplayPort | DisplayPort 1.4a , DP++ Max resolution up to 4096x2160@60Hz |
HDMI | HDMI 2.0b Max resolution up to 4096x2160@60Hz |
VGA | Max resolution up to 1920x1200@60Hz |
RF& Antenna | 8 x SMA connector hole reserved |
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M.2 | 1 x M.2 (Key E, 2230) with CNVI/PCIe Gen3 x1 and USB2.0 for Wi-Fi/BT module 1 x M.2 (Key B1, 2280/3042/3052) with PCIe Gen3 x1 / USB3.2 Gen1x1 and USB2.0 for 4G / 5G 1 x M.2 (Key B2, 3042/3052) with PCIe Gen3 x1 / USB3.2 Gen1x1 and USB2.0 for 4G / 5G |
SIM Socket | 2 x Nano SIM Card slot (2 connected to M.2 Key B) |
Interface | Realtek ALC897, High Definition Audio.. |
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Controller/ Speed | 2 x Intel® i226IT 2 x Intel® i226IT (PoE Support, each port supports IEEE 802.3AT PoE, PoE output max.30W/single port or 30W/two ports shared) |
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Connector | 4 x RJ45 |
DisplayPort | 1 |
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HDMI | 1 |
VGA | 1 |
Ethernet | 4 x Intel 2.5G LAN |
USB | 4 x USB 3.2 Gen2x1, 2 x USB 2.0, 1 x USB2.0 internal connector w/ lock function |
Audio | 1 x Mic-in, 1 x Line-out |
COM | 4 x RS232/422/485 (COM1, COM2- optional Card w/ Isolation Protection, COM5- Isolation Protection , COM6) 2 x RS232 (COM3, COM4) |
DIO | 8DIs/8DOs |
M.2 | 1 x M.2 (Key M, 2242/2280/22110/25110) with Gen3 x1 for NVMe SSD |
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SATA | 4 x SATA3 (6Gb/s) Accommodate up to 4 x 2.5" HDD/SSD Tray (Default 1 piece, additional HDD trays are available as optional parts for order) |
CFast | 1 x Type II socket (Shared with SATA3) |
Output | From Super I/O to drag RESETCON# |
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Interval | 256 Segments, 0, 1, 2, ...255sec |
Input PWR | 9V~36V VDC with Ignition control and remote power on/off switch. 80V Surge Protection, OVP, UVP, OCP and reverse protection Ignition Power Input w/ 13-mode condition |
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Operating Temp | 35W CPU: -40°C~70°C ( -40°F~158°F) 46W~65W CPU: -40°C~50°C ( -40°F~122°F) (w/ air flow 0.5~0.8 m/s) |
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Storage Temp | -40°C~85°C ( -40°F~185°F) |
Humidity | ~95% @ 40°C (non-condensing) |
Shock | Operating: 50G, half sine 11ms duration with SSD (More stringent than MIL-STD-810H) |
Vibration | Operating: 5 Grms, 5-500 Hz, 3 axes with SSD (More stringent than MIL-STD-810H) |
ESD | Contact +/-4kV, Air +/-8kV |
EMC | EN61000-6-4/-2, CE & FCC Class A |
Safety | LVD |
Construction | Aluminum heatsink + Metal chassis |
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Mounting | Desk Mount |
Dimensions | 201.7mm (W) x 244.8mm (D) x 109.5mm (H) (7.94" x 9.64" x 4.31") |
Net Weight | 6.5kg |
OS Support | Windows 10 & Linux |
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TPM | TPM 2.0 |
Real-Time Enablement | TSN, TCC support under YOCTO |
The specification is subject to change without notice in advance. The brand and product names are trademarks of their respective companies. Any configuration other than original product specification is not guaranteed.